ECE4755 [at Georgia Tech]

Packaging Substrate Fab, 3 credit hours — This course provides hands-on instruction in basic packaging substrate fabrication techniques, including interconnect design and testing, dielectric deposition, via formation, and metallization. Crosslisted with CHE 4755.

Prereqs

All of:

Taught by:

Mohanalingam Kathaperumal

Teacher information not finished yet!

Main sections

ECE4755A

Linked sections

Taught by Mohanalingam Kathaperumal. CRN is 87175, [view on OSCAR].

Meetings
  • 12:30PM-1:20PM in J. Erskine Love Manufacturing room 299 every Friday

0/0 waitlist spots left

Other sections

ECE4755LA

Linked sections

Taught by Mohanalingam Kathaperumal. CRN is 85458, [view on OSCAR].

Meetings
  • 3:30PM-6:15PM in J. Erskine Love Manufacturing room 299 every Tuesday, Thursday

2/3 waitlist spots left