MSE4755 [at Georgia Tech]

Packaging Substrate Fab, 3 credit hours — This course provides students with hands-on instruction in basic SOP concepts and techniques, including interconnect design, substrate material selection and properties, photodielectric deposition, via formation and photolithography, copper metallization, and finally, substrate testing. Laboratory instructions are augmented by an interactive multimedia educational presentation that makes the course work material remotely accessible via the internet.

Prereqs

All of:

• One of:

  • MATH2401
  • MATH2411
  • MATH24X1
  • MATH2551
  • MATH2X51
  • MATH2561

• One of:

  • MATH2403
  • MATH2413
  • MATH24X3
  • MATH2552
  • MATH2X52
  • MATH2562
• CHEM1211K
• PHYS2212

Taught by:

Mohanalingam Kathaperumal

Teacher information not finished yet!

Main sections

Other sections